Sarine Quazer™ has a long track record in the green laser diamond sawing industry. The first generation device was launched in 2007, the second generation in 2010, and Quazer™ 3, the most recent version, hit the market in 2014. The Quazer holds a prominent position in the high-end segment of the market, renowned as an ideal sawing solution for high quality, high end goods. In this month’s Diamond Tech post, we’re going to take a look at the unique features of the Quazer 3 green laser sawing machine. But first, let’s take a walk through some of the general principles of laser sawing.
What are the qualities that make a good laser sawing machine?
- Minimal damage. A proven record in generating minimal damage to the rough diamond during laser processing, based on years of optimization.
- Handling high tension. The capability to minimize damage when handling stone tension is of key importance during laser sawing.
- Minimal weight loss. Working with an optimized green laser machine that has double sided sawing capabilities helps to reduce weight loss from the rough due to the sawing process, thereby maximizing the polished yield.
- Smooth surface after sawing. This prevents the need to polish the surface after laser sawing, which also helps to reduce weight loss.
The Quazer machine meets all the above requirements for effective green laser sawing, and it offers a number of other interesting features that take it a step ahead.
Linking Rough Planning to Sawing with Strategist
Strategist™ is a set-up station that connects Sarine’s Advisor™ rough planning software to the Quazer laser sawing system. It increases productivity by streamlining the processes of planning and sawing. It also enables the operator to adapt the sawing strategy pending inclusions in the saw plane that are discovered during sawing. This creates more transparency and confidence in the planning of the sawing process.
Pie Shaping Support – Single Glue
In the market today, most diamonds that undergo Sarine Galaxy™ inclusion mapping are pie planned. The increase in the use of pie planning is due to one major advantage – it enables the planner to extract more from the rough diamond. However, performing pie sawing without special equipment requires manual setup by experts, and demands a lot of work and experience.
Together with the Strategist™ set up system, the Quazer 3 offers automatic pie sawing capabilities, which only requires a single, simple set up procedure (single glue). This minimizes the opportunity for human error, and the need for individual skilled labor.
Focus on Hardware
The Quazer 3 was designed with some major hardware upgrades, which create a smoother user experience based on improved performance, stability and servicing. These include a fully sealed optical path that prevents dust from accumulating on optical parts, and a new “plug and play” electrical cabin that allows for easier maintenance. In addition, the Quazer 3’s new feedback motor and driver systems ensure strict monitoring of the machine axis movement.
Quazer 3™ Add Ons that Take Laser Sawing into New Territory
With the proliferation of lab-grown diamonds on the market, the Industrial Cutting add on enables manufacturers to perform special cutting and shaping jobs on both natural and synthetic diamonds. It also supports the import of 2D shapes from CAD files for laser sawing of customer-proprietary shapes.
A unique sawing method that shapes a rough diamond into its final polished shape in one quick step, the Shaping add on is mainly used for fancy shapes. It enables the user to maximize productivity and minimize human error when working with more complex fancy shapes.
Want to find out more about Quazer™ 3 green laser sawing?
Click here to view the product specifications.
To download the Quazer™ 3 and Strategist™ user manuals, visit the Sarine Support page, and select the Laser Processing category.